Characteristics of Low Temperature Iron Plating Technology

In the hardware manufacturing industry, one technique that is often used is low temperature iron plating technology. Low-temperature iron plating refers to the iron plating process with an asymmetrical alternating current flowing at a lower temperature (4[deg.] C. can start plating). The principle is to make the two half-waves of the alternating current unequal by means of certain means. After the power is turned on, the larger half-wave makes the workpiece cathode-polarity and is plated with a plating layer; the other half-wave makes the workpiece anode polarity. Electrolysis of some of the plating, so that gradually thickening plating. The low-temperature iron plating equipment is simple, the obtained coating is uniform, the surface is smooth, and the bonding strength is high.

Characteristics of low-temperature iron plating (1) Low-temperature iron plating layer has high hardness, and the hardness range can be adjusted through process control. Rockwell hardness can reach up to 63-65.

(2) The iron plated layer is integrated with the substrate, and the bond strength between the plated layer and the substrate is high. Microscopically, the ferrite and matrix ferrite of the iron-plating layer were continuously distributed.

(3) The surface of the coating is micro-cracked and mesh-like. Good oil storage performance and good wear resistance.

(4) The deposition rate of low-temperature iron plating is fast, about 0.6-1.0 mm/h, and the coating thickness can reach 2 mm at a time. In addition, the cost of the iron plating is low and non-toxic, so it can be widely used.